Conduction cooled vpx. 0 in. Conduction cooled vpx

 
0 inConduction cooled vpx VX3060-S2 Rugged Conduction cooled version is a Plug-in unit according to VITA 48

2 chassis, heat is conducted away from hot module components through the heat sink and out to the module wedge locks. or 1. 3U CompactPCI Development Platform for Up to Eight Conduction-Cooled Modules. View product. It provides guidelines for constructing the frame, which is an essential part of the conduction-cooled module’s thermal management. (604) 875-4405. 2 (REDI) )0 inch pitch conduction cooled payload slots in Long format (# of slots in Short format TBD) Configurable rigid front I/O PCBA and 7. X-ES provides a comprehensive line of 3U CompactPCI (cPCI) and 6U cPCI products, including Intel® cPCI, PowerPC cPCI, and QorIQ cPCI Single Board Computers (SBCs), carriers, I/O cards, development platforms, and deployable systems for embedded computing applications. This platform supports up to eight 0. Combine various standard components to create a Wedge Lok that satisfies your requirements. Item/Part Number: 1940000376-0000R Product Features. 0 and VITA 65 connector interoperability. Compared to conventional wedgelocks, the ICE-Lok ® creates additional heat transfer paths from card to chassis, thereby reducing the thermal resistance. See full list on xes-inc. 3U VPX Graphics. 2, “Mechanical Specification for Microcomputers Using REDI Conduction Cooling Applied to VITA VPX”, developed by VITA, defines the mechanical requirements that are needed to ensure the mechanical interchangeability of air-cooled 3U and 6U plug-in units and define the features required to achieve two level maintenance compatibility. The Condor GR5-P2000 is a 3U VPX graphics & GPGPU card that is based on the “chip-down” NVIDIA® Quadro® Pascal™ P2000 GPU (GP107). VME / VME64x Backplanes Our VME Backplanes are made for industrial applications in different form factors, including vertical and horizontal orientation of the backplane and cards. Of the two VPX mechanical form factors, 3U is very popular in certain applications, and 6U is sometimes necessary to build highly parallel systems with optimal computing density. AoC3U-610 Conduction Cooling with Air Assist. COOLING EMBEDDED VME AND VPX SYSTEMS. This extensive line includes conduction cooled VPX, air cooled VPX, as well as VPX ATR configurations. Today ATR’s are introduced into applications imagined never before, including surveillance, data collection, storage and weapons control. The WILDSTAR 3XV7 integrates Xilinx's new Versal™ Premium VP1502 or VP1702 FPGA. 8 in. Physical Characteristics. Grabcad 3U Vita Card. The XPand1303 is a low-cost, flexible, development platform. The 7-slot air-cooled Chassis and Backplane incorporates slots for up to four conduction-cooled 3U VPX Payload Boards, plus a 100GbE Switch, SBC, and VITA 62 power supply, delivering up to 700W. Compare. It also supports dual Gigabit Ethernet, GPIO, I²C, XMC I/O, PMC I/O. 3 to the P15 connector for interfacing with the host module. This platform supports up to eight 0. With a Core 2 Duo processor at up to 2. or 1. Dawn created the “CUBE” family of enclosures to address the needs of the UAV market. This 3U VPX payload slot module can be used to extend the PCIe bus to any other PCIe based. See the Rugged section for more details. Conduction or air cooling. It is designed for use in deployed industrial and military applications in harsh environments. The rugged. It also supports IPv6 and a comprehensive set of IETF RFCs and IEEE protocols. The XPedite5570 supports up to 8 GB of up to DDR3-800 ECC SDRAM, as well as up to 32 GB of NAND flash and up to 512 MB of NOR flash (with redundancy). It defines a keying system that can be added to VME64x boards and backplanes in a conduction cooled environment (IEEE 1101. 8 in. (L) x 4. One high-speed link on VPX-P1(control plane) Up to twelve high-speed linkson VPX-P1. StoreEngine is designed to work as a standalone single slot storage device with. These PSUs are available in 3U or 6U form factor. 400 Watts output power over a wide temperature. It features dual 9 slot backplanes including PSU slots. Conduction- or Air-Cooled 3U VPX-REDI XMC/PMC Carrier Card. 3U VPX Embedded SBCs offering unparalleled performance from cutting-edge Intel or NXP (Freescale) processors & features like integrated FPGAs & SecureCOTS™. Conduction Yes 12 TB 5 GB/s Yes Host Based Yes 7x PCIe Gen3 x4/x8 If used with StoreEngine. It offers multiple pickets mixed with the DDS and fixed VCOs mixed with the wideband DDS. Since heat energy wants to move from. 2 Type 2, Secondary Side Retainer. 40GbE. The 3U VPX form factor is compatible with several VITA standards including: VITA-46, VITA-48 and VITA-65. 62H. Compare. Login. Our Card and Software Packages are Designed for Fast, Portable Integrations. 5” front panel with Hercules ® high-speed, ruggedized, circular mil connectors allows customization to exact application requirements. The XPand1007 can be configured as two I/O isolated slots, with all I/O from the payload passed to the RTM. Learn more about this product below » Acromag’s XMC-7A200CC modules feature a high-performance user-configurable Xilinx® Artix®-7 FPGA enhanced with high-speed memory and a high-throughput serial bus interface. 0 in. The 3U VPX backplane uses standard 1. These 3U VPX boards are delivered with full artifact packages to reduce the risk, cost, and development time required to reach certification. Accessories. or electronic warfare capabilities, which means that AFT-cooled plug-in VPX modules – including both 3U and 6U form factors – retains the current VITA 46. Verifies chassis can meet power requirement and specifications for VPX. Part of our LoC3U-500 Series of liquid cooled enclosures, the LoC3U-510 is an ATR chassis designed to maintain safe operating temperatures for high power 3U VPX conduction cooled systems. 8 in. A network-attached Flyable Data Loader (FDL). available in air cooled or conduction cooled with thermally efficient heatsink technology and rear I/O. 2 RS-232, 2 RS-232/422/485 Chassis Type: Sub-½ ATR Number of Slots: 2 Chassis Cooling: Conduction-Cooled, Natural Convection-Cooled. 1, titled “VPX Conduction Cooling: Frame Construction,” extends the VITA 48. 0 VPX: Coaxial Interconnect – Base Standard. 1 compliant products to extend the temperature range of operation to drive the costs down To keep the weight low to avoid the use of other less cost effective solutions based for instance on the VITA 48. Cooling air flows directly over the board. This platform supports up to eight 0. This forced-air-cooled, fully ruggedized chassis is designed to meet the rigorous standards of MIL-STD-810F/G while integrating the latest power-saving and performance-enhancing technology. Up to four power supplies can be paralleled to increase. AT-VPX-PMC/XMC-CAR is one of a family of modules to employ open architecture VITA 46 standard primarily to marry High Speed Interconnect such as Rapid IO and PCI Express. The VPX base standard defined in VITA 46 is a scalable module and backplane technology designed specifically for high speed, critical embedded systems. It is designed to maintain power to critical systems during short interruptions or voltage fluctuations in the main power source. . This fully-defined, backplane-centric VPX module optionally supports either commercial GNSS receivers (i. View. 2 conduction cooled modules because of their established deployment track record. Operating Temperature: -40C to +85C. Both are designed to support a minimum of ten 0. It supports up to two 0. pitch conduction. (L) x 4. 3 V @ 9 mA to 60 mA) 1 PPS Output: TCXO OCXO OCXO Rugged Option (VPX only) Accuracy to UTC (1-sigma locked to GPS) ±50 ns ±50 ns ±25 ns Holdover (constant temp after 2 weeks of GPS lock) After 4 hours 12 μs 3 μs 1 μs After 24 hours 450 μs 100. Related standards not addressed in this paper, and specifying conduction cooled implementations for Eurocard, are VITA 48 describing VPX VITA 46 mechanical implementations and VITA 57 dealing with FMC mezzanines. DECISIVE PERFORMANCE. The development systems use Concurrent Technologies' commercial off the shelf boards which are also available as rugged conduction cooled, VPX-REDI boards ensuring that applications which are produced on the development Systems can be easily progressed to a ruggedized implementation. 14 Slot VPX Conduction-Cooled System with Air Assist. This short 1/2 ATR ships with a 6-slot OpenVPX™ backplane and can accommodate other architectures such as 3U CompactPCI® and MicroTCA™. They are low-power system-on-chip (SoC. VX3060-S2 Rugged Conduction cooled version is a Plug-in unit according to VITA 48. , November 2023 – Elma Electronic now offers the NetKit-3110, based on the Cisco. An AFT heat frame includes a closed duct, which is embedded with fins. The modules can be easily tailored to suit individual requirements, VPX Test Adapter. WOLF’s 3U VPX modules use the 1" pitch allowed in VITA 48 (VPX REDI). VPX MEDIA CONVERTER MODULE SUMMARY CF-020010-57X 57X Block Diagram VITA 48. The. View product. 115 Watts Primary or Secondary Side wedgelocks. Block Diagram. pitch slots and built in accordance. The system leverages LCR’s 600 Series AoC3U-620 chassis for VITA 48. Provision is also made for air-cooling via. , a leading supplier of conduction cooled VPX systems, has been awarded by a prime contractor based in Maryland, to deliver DesertGecko 3U VPX systems based on Juniper Networks LN 1000 router and PCI-Systems managed conduction cooled Gigabit Ethernet switch. With a total of six high-performance Gigabit Ethernet interfaces (2 routed, 4 switched), the 3U conduction-cooled (VITA 48. 2 conduction cooled configuration and ready for rugged applications. Intel® Xeon® D-1500 Processor-Based Rugged Small Form Factor (SFF) COTS System with Xilinx Kintex® Ultrascale™ FPGA. 1” Pitch (Conduction Cooled) 0. 91 KB. Input Voltages: 85-264 VAC, 5. Convection (air) and conduction with extended temps. Elma’s conduction cooled power supply modules are designed to meet the requirements of VITA 62 for use in harsh environments. VPX Carrier Cards Bulletin #8400-626i Air-cooled, conduction-cooled and REDI versions 3U One PMC/XMC slot PCIe x8 Gen 2 interface VPX4810 VPX Carrier Cards for XMC or PMC Modules Conduction-cooled version VPX REDI VITA 48 version P2 PCIe x4 PCIe x8 PCIx 64-bit PMC I/O PMC/XMC Site P1 Port A PCIe x8 PCIe Switch PCIx to PCIe Bridge. While air and conduction cooling are often implemented to address cooling challenges, liquid cooling solutions can be effective for designs at the chassis,. N/A. Five slots 3U VPX conduction cooled Chassis. Block Diagram. Pictured above (from top counter-clockwise) : Acromag VPX4810 PMC/XMC carrier card in air-cooled, conduction-cooled, and VPX-REDI formats. conduction-cooled heatframes are mechanical assemblies which perfectly match the component topography & requirements of a pcb intended for an embedded computing. The Chassis Manager is VITA 46. This platform supports up to eight 0. WOLF carrier boards are designed to provide system designers with a flexible, highly configurable PCI Express interface. In some ways, AFT is a hybrid between air and conduction cooling, but with greater cooling capability. VPX-XMC Conduction-Cooled Adapter Assembly . Block Diagram. 2 mechanicalformat. It supports 3rd Gen Intel Core series processor and Intel QM77 chipset. The XChange3000 is a 3U VPX-REDI module supporting a single-width XMC or PrPMC card. 8 in. 0 in. This system supports standard SBC and switch modules, as well as VITA 67 modules, making it the ideal platform for high-performance RF applications. Physical Characteristics. LXH0000840; Request a Quote. 3U VPX carrier card. slots support conduction-cooled 3U VPX, 3U cPCI, or power supply modules. This 3U Module enables an isolated thermal path Air Flow Through (AFT) – ANSI/VITA 48. 0 in. Air-cooled, conduction-cooled and REDI versions; 3U Single XMC slot; PCIe x8 Gen 2 interface; The VPX4812A can be used as a VPX switch card allowing a host CPU to communicate with up to 3 downstream cards in addition to the XMC card. The modules can be easily tailored to suit individual requirements,VPX Test Adapter. Most VPX systems use VITA 48. Conduction Cooled Chassis » Two Intel® Core™- i7 processors with integrated DDR3 Memory Controller » 25% improvement in performance,CCE-3VX1 3U VPX 1-slot CUBE Conduction Cooled; CCE-3VX2 3U VPX 2-slot CUBE Conduction Cooled; CCE-3VX3 3U VPX 3-slot CUBE Conduction Cooled; CCE-3VX4 3U VPX 4-slot CUBE Conduction Cooled; CCE-3VX5 3U VPX 5-slot CUBE Conduction Cooled; CCE-3VX6 3U VPX 6-slot CUBE Conduction Cooled. 3. Pixus also provides conduction-cooled and customized OpenVPX enclosure solutions. The heat from the internal conduction-cooled modules is conducted to sidewall heat exchangers, where it is dissipated to the ambient environment by convection cooling or to an attached cold plate by conduction cooling. 5, air flow-through, which has the advantage of being able to meter the air to specific cards. XIt1085 (90040045) - 3U VPX Rear Transition Module with Gigabit Ethernet, SATA, USB, Serial, and DisplayPort XPand1004 (90071810) - Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O XPand1200 (90070530) - 3U VPX Development Platform for Up to Eight Conduction-Cooled. NXP (formerly Freescale) QorIQ T2081, T1042, or T1022 Processor-Based Conduction-Cooled XMC/PrPMC Mezzanine Module. XPand1007. Aisle Containment. Most VPX systems make use of VITA 48. These 3U AC supplies boast a 600W air-cooled design with an internal fan and up to 88% efficiency. MIL-STD 461. FPGA Family. The heat from the internal conduction-cooled modules is conducted to sidewall heat exchangers, where it is dissipated to the ambient environment by convection cooling or to an attached cold plate by conduction cooling. VP32004 - LinkedHope Intelligent Technologies Co. VPX carrier cards provide a simple and cost-effective solution for interfacing mezzanine I/O modules to a VPX computer system. This efficient thermal design allows up to 60 W of. VITA 48. pitch without solder-side cover (optional) 1. 1x 100GBase-KR4, 1x 10/25GBase-KR. A ternary biochar/vanadium pentoxide/graphite like carbon nitride (BC/V2O5/g-C3N4 denoted BC/VO/CN) composite was prepared by a simple hydrothermal method and its. Transfer rates up to 3940 MB/s. The new cooling standard defines design requirements for platforms that need high performance processing, graphics. The XPand1202 provides a low-cost, flexible, VITA 67 development platform. View. Product Type: Guide Rail. 625 IN : Model Number:2. All offers are typically available for. View product. Depending on local conditions, packaging and freight charges might not be included. True 6-Channel design provides full OpenVPX support. Frame has injector/ejector latches for plug-in card. VP32004 is a high-performance PC-based 3U VPX processor board developed by Linkedhope®. It can operate up to 85 °C card edge temperature according to VITA 47 Product Features. Usually the test adapter includes fields for voltage and amp, current measurements and in some cases also some pins for wire wrap to conduct custom. VPX (Virtual Path Cross-Connect), also known as VITA 46, is a set of standards for connecting components of a computer. The board supports tunable bandwidths from 200 kHz to 56 MHz over a frequency range from 70 MHz to 6 GHz. 8&quot; conduction cooled VPX power supplies, built to satisfy the most challenging application requirements while providing up. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3. The WC31DH Chassis incorporates slots for up to eight conduction-cooled 3U VPX Payload Boards, two HD Switches, a Radial Clock, and two VITA 62 power supplies. • Supports 6U VME, cPCI, and VPX modules at 0. 0 port is routed per VITA 42. Power Supplies are available in 3U and 6U, in air- and conduction- cooled form factors >for cPCI, VPX, VME64x & custom applications. • Rugged VPX systems where thermal performance is a concern • Options for second level maintenance APPLICATIONS • Meets VITA 48. Conduction-Cooled. The open frame concept offers enhanced flexibility, with fast conversion between air and conduction cooled module guides and fast backplane replacement for easy reconfiguration in support of. It’s hybrid cooling design stretches the cooling capabilities in equipment built with readily available VPX, VITA 48. 8 in. 2 / VPX conduction cooled thermal load board module. VStream-VPX Datasheet Order Enquiry for VStream-VPX. WOLF carrier boards are designed to provide system designers with a flexible, highly configurable PCI Express interface. Products. Data Plane. Download. Continuous 580W output over temperature range of-40C to +85C. ruggedization solutions for vpx & cpci. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3. The XPort3305 is a conduction-cooled dual 10 Gigabit Ethernet XMC with front and rear panel I/O support. Conduction-Cooled Assemblies (CCA) adaptor (EuropacPRO/-rugged, VPX/CompactPCI) *The price shown is the per piece price and does not include VAT. 2 Type 2, Secondary Side Retainer. Learn more about this product below »Acromag’s XMC-7A200CC modules feature a high-performance user-configurable Xilinx® Artix®-7 FPGA enhanced with high-speed memory and a high-throughput serial bus interface. The XChange3000 provides easy integration of standard mezzanine cards into modern VPX backplanes. The XChange3012 is a conduction- or air-cooled 3U VPX module that provides both PCI Express and Ethernet switches. Conduction cooled 3U VPX module; Mechanical. Formally known as ANSI/VITA 48. or 1. Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O. Also available: 3U VPX HOST SIDE Bus Extention Adapter PCIe Gen. Eight 6U VITA 48. We offer air & conduction cooled power supply units for wide range AC as well as DC input. or electronic warfare capabilities, which means that AFT-cooled plug-in VPX modules – including both 3U and 6U form factors – retains the current VITA 46. It is available in air-cooled and conduction-cooled versions. Conduction cooled or air cooled; Conformal coating; RoHS or leaded soldering; SWaP (Size, Weight, and Power) Long-term product availability and support;. Rugged Design Kit for development of 3U conduction-cooled VPX single board<br /> computers. 8”. The Chassis CPU will monitor and maintain the VPX module wedge. The VPX-REDI specifications of VITA 48. 3U Air cooled models available in 1. With both air-cooled and conduction-cooled boards and. (0°C to +55°C) and conduction-cooled version (-40°C to + 85°C). Form Factor: VPX Size: 3U. VITA 91 high-density connectors allow for a completely switched backplane. Dawn’s PSC-6238 is a wedge lock conduction cooled module on a 1 inch pitch with an operating temperature of -40 0 C to +85 0 C at the wedge lock edge. FPGA Resources. 0 in. 3 V. Zynq Ultrascale+. PSC-6236 Product Datasheet. Air-cooled, conduction-cooled, REDI versions; 3U single PMC/XMC slot; PCIe x8 Gen 2 interface; These 3U mezzanine carrier cards provide a simple and cost-effective solution for interfacing a PMC or XMC module to a VPX computer system. Input: 80 to 264V AC. The XPedite8101 is an Intel® Atom™ E3800-based XMC/PMC available in conduction- and air-cooled configurations. Accommodating cooling methods that include forced air, conduction, and liquid. Hartmann Electronic power supplies are designed for extreme environmental and demanding electrical conditions for various applications which are based on PICMG 2. It supports up to two 0. The XPedite7770 is a secure, high-performance single board computer based on the Intel® Xeon® D-1700 series (formerly Ice Lake-D) of processors, making it an optimal choice for computationally heavy applications requiring. pitch conduction-cooled VPX (VITA 48. Available for use in either AC or DC systems, they are 6U high by 5HP (1-inch) wide modules with guide blocks, for use in VPX systems. (VPX / cPCI/ VME) and custom designs. The XPand1007 system is a low-cost development platform for conduction-cooled 3U VPX cards. 3U VPX – OpenVPX Backplanes3U VPX rugged ATR chassis systems supporting up to six modules, designed to meet the rigorous standards of MIL-STD-810F/G and DO-160. 2-2020: Mechanical Specification for Microcomputers Using REDI Conduction Cooling Applied to VPX; This Standard defines the mechanical requirements that are needed to ensure the mechanical interchangeability of conduction cooled 3U and 6U Plug-In Modules and defines the features required to achieve Two. The removable storage canisters can be optimized for client operations. Standard Air- and Rugged Conduction-Cooled Versions; Download Datasheet Request information Add to compare. The AcroExpress® VPX6860 is a high performance 6U OpenVPX™ single board computer based on the 6th Generation Intel® Xeon® E processor (formerly Skylake) and PCH. LCR’s product line of rugged ATR chassis and integrated systems offer VPX packaging solutions for applications requiring 1-slot to 18-slots. The carrier card routes power and bus signals to a plug-in mezzanine module through the VPX card slot connector. OC-CC-VPX-3U-5HP-SS-300-LB48 WT ASSY # - 43094 3U VITA 48. 1. 6GHz Thirty-two. 3A/37A (normal/peak inrush current)performance leaps relative to VME and early VPX systems of just a few years ago. It features dual 9 slot backplanes including PSU slots. Conduction cooled card guide for Dawn DC- (n) Series air cooled development chassis. <br /> Wavetherm Corporation. 0. Air cooled: 3U VPX 0. The Extreme Engineering Solutions XPand6200 Series Sub-1/2 ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules is a true Commercial-Off-The-Shelf (COTS) Rugged system, supporting many 3U VPX, XMC, and PMC modules without modifications to the chassis or backplane to. Accessories. 11 12 V 3. [email protected] Single Board Computer. 2. The Ruggedized Enhanced Design Implementation (VPX-REDI) lays out the mechanical design requirements for forced-air cooling, conduction cooling, and liquid cooling in VPX modules, providing detailed. It provides guidelines for constructing the frame, which is an essential part of the conduction-cooled module’s thermal. 3U VPX with NVIDIA Jetson AGX Xavier Industrial and ConnectX-6, SOSA aligned Payload profile module for HPC tasks such as sensor data processing, machine vision, and other C4ISR tasks. PRODUCT ATTRIBUTES. CCG-6860 Conduction Cooled Card Guide. Load board for VPX systems, meets ANSI/VITA mechanical and electrical connection standards; Verifi es chassis can meet power. The heat from the internal conduction-cooled modules is conducted to sidewall heat exchangers, where it is dissipated to the ambient environment by convection cooling and to an attached cold plate by conduction cooling. Ideal for SBCs or carriers for VPX, VME and cPCI (Compact PCI/PCIe or PXI) - Commercial or Rugged/Conduction Cooled Systems. Development chassis and accessories for VPX and SOSA aligned module payloads to support every stage of product development. VITA 62 power connector. 8 in. 0 in. Categories:. True 6 Channel supply provides full Open VPX support. Also Available: A rugged ATR versionFeatures. 2 / VPX conduction cooled thermal load board module. The COOL-CC3 chassis is a 6-slot, 3U, VPX, forced-air, conduction-cooled portable tower chassis ideal for lab development. The chassis is designed for plug in cards in alignment with the SOSA technical standard. This short 1/2 ATR ships with a 6-slot OpenVPX™ backplane and can accommodate other architectures such as 3U CompactPCI® and MicroTCA™. Author: Reggie. Up to 1080p30 or 1080i60. 2 struggles to dissipate the attendant heat using straight conduction cooling – leaving system designers with only two choices; move to VITA REDI alternatives or stick with VITA 48. Study, diagrams and routing of the VPX and cPCI dual bus integrating high-speed links between. NXP QorIQ T2080 Processor-Based Conduction- or Air-Cooled 3U VPX SBC. Power and reset LEDs are provided for system status. The VPX340 (400W) and VPX336 (360W) can be used to power VPX / Open VPX chassis and will fit into the standard. pitch conduction-cooled VPX (VITA 48. 4 mm Compliant with the VITA 78 SpaceVPX standard For lab variant: Air-cooled metals For flight variant: Conduction-cooled metals Up to 12 Rx/Tx mid-board fiber transceivers System Manager FPGA For lab variant: ACT-H3KI-CG624: ProASIC3: A3PE3000-2FG896iPCI-SYSTEMS Inc. See specifications for target performance. Level 1-5 Air, Conduction Cooled. Acromag’s XMC-7K modules feature a high-performance user-configurable Xilinx® Kintex®-7 FPGA enhanced with high-speed memory and a high-throughput serial bus interface. 0 in. VPX7650. Compare Products. The logic-optimized FPGA is well. Sub-½ ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules. Nerve conduction studies (NCS) are tests used to evaluate the function of the peripheral nerves. The XChange3012 supports an. It delivers cooling performance comparable to conduction-cooled systems, yet is easier to implement and weighs much less than a comparable. The RFDC contains two (2), full spectrum, Non-blocking RF Down Conversion Modules (DCMs). Compare. Today’s designs must be. [Table 1| These numbers compare cooling capacity using passive, air-assist, and liquid-assist conduction cooling in six-slot VITA 48. or 1. The XPand1015 system is a low-cost development platform for conduction-cooled 6U VPX cards. Integrated security features for reliable, secure data transmission. One Payload and remaining Peripheral Slots (with Switch slot option) High Speed fans with 1U Tray at the bottom. VTX989 is a five slot 3U VPX conduction cool chassis; Base plate cooling (cold wall is in the bottom of the chassis) Integrated Power Module within the Chassis; Support for VITA67. VITA 62 Compliant 3U VPX power supply. or 1. Controlled impedance rigid-flex-rigid design. Conduction cooled at card edge (Air Flow Through or Air Flow Over available) Conformal coating on PWB; 3U VPX. Shock: 40G peak for conduction-cooled; Dimensions: 160mm x 100mm x 25. 2) modules. It supports up to two 0. Quick. Hartmann Electronic VPX Standard Chassis are designed to allow any COTS or customer spec configuration in either 3U or 6U form factor taking into account a wide range of. Development chassis for VPX and SOSA aligned module payloads. Intel® Xeon® D-1700 Processor-Based 3U VPX-REDI Module with 48 GB of DDR4, 40 Gigabit Ethernet, and SecureCOTS™. Description. See the Rugged section for more details. With an auto-ranging 90 to 264VAC input, PFC, and military EMI filtering, the PUMA-2509 gives 300W to 6 fully controlled and regulated outputs. Reconfigurable. Select one of the products below to see specifications and learn more. 00" pitch. Mechanical frame supports 3U, 160mm plug-in card. 52 in. 2775 Laurel Street Vancouver, BC V5Z 1M9. 4-Slots of 3U VPX on 1″ pitch (OpenVPX Ready) Integrated intelligent Power Supply provides up to 400 Watts of 6-channel power. Abaco’s SBC3612D rugged 3U VPX single board computer delivers the highest performance you can get in a 3U Intel® base. The XPand1015 can be configured as two I/O isolated slots, with all I/O from the payload passed to the RTM. 8 Air Flow Through Cooling; Powerful push-pull cooling of front cards. NXP (formerly Freescale) MPC8640D Processor-Based Conduction- or Air-Cooled 3U VPX-REDI Single Board Computer (SBC) The XPedite5170 is a high-performance 3U VPX-REDI single board computer based on the NXP (formerly Freescale) MPC8640D processor. 2 struggles to dissipate the attendant heat using straight conduction cooling. The chassis is also designed for plug in cards in alignment with the SOSA technical standard. Embedded RuSH technology actively monitors voltage, current and temperature and talks over system management bus using I2C. Power Supplies. 3V_Aux. 6U VPX boards and utilizes RTMs to simplify I/O access and support rapid system prototyping. Product Features. A x8 PCI Express 2. 300-400 Watts Pluggable VPX PSU. Acromag VPX products are designed for COTS applications. Conduction-Cooled 3U VPX-REDI XMC Carrier Card. Serial I/O. AoC3U-410 Conduction Cooling with Air Assist. The conduction-cooled module version of VPX-REDI (Figure 3) can be on either a . DECISIVE PERFORMANCE. The design incorporates a Blu-Ray drive, SBC, Power Supply and ECS (Environmental Control System). Utilizing our extensive experience in embedded. Data Center Solutions. Item/Part Number: 1940000446-0000R Product Features Load board for VPX systems, meets ANSI/VITA mechanical and electrical connection standards Verifies chassis can meet power requirement and. Folder. 3 Up to 24x 10 GETH. This dual-port Ethernet XMC card is designed and tested to VITA 47 environmental standards for air-cooled or VITA 20. Configure your PCB Wedge Lok. 8 in. 2 extraction levers and performance wedge locks • 3X - Samtec HQDP connectors for 1G. Backplanes are 100% configurable using Meritec cabling allowing. The patented Isothermal Card Edge ICE-Lok ® is designed to enhance thermal performance for conduction-cooled embedded computing systems. 877-214-6267 salesacromag. 1-1997. This enables the VX305C-40G to sustain 70°C card edge temperature according to VITA 47 XMC support. With multiple high-speed fabric interfaces, external memory, Xilinx Virtex-7 FPGA, an FMC site, and high-density I/O, the XPedite2470 is ideal for customizable, high-bandwidth, signal. Combine various standard components to create a Wedge Lok that satisfies your requirements. XIt1086. 6U VPX boards and utilizes RTMs to simplify I/O access and support rapid system prototyping. 4. 2-7. Embedded RuSH technology actively monitors voltage, current and temperature and talks over system management bus using I2C. The open frame design includes a backplane, power supply, fan cooling, and rear transition slots in support of a variety of test functions. The XChange3000 provides easy integration of standard mezzanine cards into modern VPX backplanes. 1 switch and 10G backplane Ethernet switch in a single 3U module, enabling you to connect between a wide range of module types – including those with earlier Gen 1 or Gen 2 PCIe interfaces. New mobile-class OpenVPX products augment Mercury's server-class and GPGPU building blocks providing latest processor technologies for embedded real-time applicationsMechanical Specifications for Microcomputers Using REDI Conduction Cooling Applied to VITA VPX: This standard defines the mechanical requirements that are needed to ensure the mechanical interchangeability of conduction cooled 3U and 6U Plug-In Modules and defines the features required to achieve Two Level Maintenance compatibility. Reviews aren't verified, but Google checks for and removes fake content when it's identified. or 1. 11. VITA 67.